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1

Russia's New Look Army Reforms and Russian Foreign Policy

Lannon, Gregory P.

Journal:

The Journal of Slavic Military Studies

Year:

2011

Language:

english

File:

PDF, 211 KB

english, 2011

2

High Density Metal–Metal Interconnect Bonding for 3-D Integration

Lannon, J.M., Gregory, C., Lueck, M., Reed, J.D., Huffman, C.A., Temple, D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 2.20 MB

english, 2012

3

Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

Lannon, John, Hilton, Allan, Huffman, Alan, Butler, Marianne, Malta, Dean, Gregory, Chris, Temple, Dorota

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 1.23 MB

english, 2014

4

Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration

Huffman, Alan, Lannon, John, Lueck, Matthew, Gregory, Christopher, Temple, Dorota

Journal:

Journal of Instrumentation

Year:

2009

Language:

english

File:

PDF, 948 KB

english, 2009

5

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits

Lueck, M.R., Reed, J.D., Gregory, C.W., Huffman, A., Lannon, J.M., Temple, D.S.

Journal:

IEEE Transactions on Electron Devices

Year:

2012

Language:

english

File:

PDF, 710 KB

english, 2012

6

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Characterization and modeling of copper TSVs for silicon interposers

Malta, D., Gregory, C., Lueck, M., Lannon, J., Lewis, J., Temple, D., DiFonzo, P., Naumann, F., Petzold, M.

Year:

2013

Language:

english

File:

PDF, 955 KB

english, 2013

7

SPIE Proceedings [SPIE SPIE Defense, Security, and Sensing - Orlando, Florida (Monday 5 April 2010)] Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV - Recent advances in high density area array interconnect bonding for 3D integration

Lannon, Jr., J. M., Gregory, C., Lueck, M., Huffman, A., Temple, D., Moll, A. J., Knowlton, W. B., Buford, Jr., James A., Murrer, Jr., Robert Lee

Year:

2010

Language:

english

File:

PDF, 2.21 MB

english, 2010

8

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - High density interconnect at 10µm pitch with mechanically keyed Cu/Sn-Cu and Cu-Cu bonding for 3-D integration

Reed, Jason D., Lueck, Matthew, Gregory, Chris, Huffman, Alan, Lannon, John M., Temple, Dorota

Year:

2010

Language:

english

File:

PDF, 1.58 MB

english, 2010

9

[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Reliability and ultra-low temperature bonding of high density large area arrays with Cu/Sn-Cu interconnects for 3D integration

Reed, Jason D., Lueck, Matthew, Gregory, Chris, Huffman, Charles A., Lannon, John M., Temple, Dorota

Year:

2010

Language:

english

File:

PDF, 730 KB

english, 2010

10

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - High resolution acoustical imaging of high-density-interconnects for 3D-integration

Brand, Sebastian, Petzold, Matthias, Czurratis, Peter, Reed, Jason D., Lueck, Matthew, Gregory, Chris, Huffman, Alan, Lannon, John M., Temple, Dorota S.

Year:

2011

Language:

english

File:

PDF, 1.78 MB

english, 2011

11

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs

Lueck, M., Malta, D., Huffman, A., Gregory, C., Butler, M., Lannon, J., Temple, D. S.

Year:

2013

Language:

english

File:

PDF, 906 KB

english, 2013

12

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - High density metal-metal interconnect bonding with pre-applied fluxing underfill

Gregory, Christopher, Lueck, Matthew, Huffman, Alan, Lannon, John M., Temple, Dorota S.

Year:

2012

Language:

english

File:

PDF, 2.39 MB

english, 2012

13

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Process integration, improvements, and testing of Si interposers for embedded computing applications

Goodwin, S., Lannon, J., Hilton, A., Huffman, A., Lueck, M., Vick, E., Cunningham, G., Malta, D., Gregory, C., Temple, D.

Year:

2014

Language:

english

File:

PDF, 2.55 MB

english, 2014

14

[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Process integration and testing of TSV Si interposers for 3D integration applications

Lannon, J., Hilton, A., Huffman, A., Lueck, M., Vick, E., Goodwin, S., Cunningham, G., Malta, D., Gregory, C., Temple, D.

Year:

2012

Language:

english

File:

PDF, 859 KB

english, 2012

15

[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Bonding for 3-D Integration of Heterogeneous Technologies and Materials

Temple, Dorota, Malta, Dean, Lannon, John M., Lueck, Matthew, Huffman, Alan, Gregory, Christopher, Robinson, J. E., Coffman, P. R., Welch, T. B., Skokan, M. R.

Year:

2008

Language:

english

File:

PDF, 700 KB

english, 2008

16

SPIE Proceedings [SPIE SPIE Sensing Technology + Applications - Baltimore, Maryland, USA (Monday 5 May 2014)] Image Sensing Technologies: Materials, Devices, Systems, and Applications - Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications

Dhar, Nibir K., Dutta, Achyut K., Lueck, Matthew, Lannon, John, Gregory, Chris, Malta, Dean, Huffman, A., Temple, Dorota S.

Year:

2014

Language:

english

File:

PDF, 631 KB

english, 2014

17

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 μm pitch

Lueck, Matthew R., Gregory, Chris W., Malta, Dean, Huffman, Alan, Lannon, John M., Temple, Dorota S.

Year:

2013

Language:

english

File:

PDF, 2.04 MB

english, 2013

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